Heat sink with chip die EMC ground interconnect（美国EMC技术专利）

sysop

  <div class="content"><p><b>Abstract</b><br />An apparatus for mounting a heat sink to a chip package such as a BGA type chip package or the like is disclosed&#46; In an exemplary embodiment, ground bumps are formed on the die substrate of the chip package and on the heat mating surface of the heat sink to be attached to the package&#46; The ground bumps formed on the die protrude into the body of dimples formed in the body of the chip encapsulation package to make thermal/electrical ground contact with the ground bumps formed on the heat mating surface of the heat sink for electrically grounding the heat sink&#46;</p><p><a href="http://www&#46;google&#46;com/patents/pdf/Heat_sink_with_chip_die_EMC_ground_inter&#46;pdf?id=bZILAAAAEBAJ&output=pdf&sig=O8GyaVMUXsHA4onQV4q5wOIcX0A"><font color="#336699">Heat sink with chip die EMC ground interconnect（美国EMC技术专利）</font></a></p></div>